Electronics Forum | Fri Oct 18 17:04:38 EDT 2002 | ereno
We have a connector mfg that claims that their design is good and does not contribute to the problem that we are having. The problem is evidence of poor soldering. All other components that surround this connector have very good solder joints, with t
Electronics Forum | Tue Jul 20 15:02:49 EDT 2010 | vetteboy86
I've seen this warp issue across several different PCB's we assemble. One of the biggest head ache's is getting the boards to transfer between machines, converyors, and inside our pick and place. Due to the warpage, transport between conveyors is dif
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Sat Aug 21 15:02:32 EDT 2010 | jry74
I have a pcb with 750 plated through holes that get Holtite sockets inserted into them. I have a method of pressing in 10 sockets at a time. However, when we are done, the board has bad warpage on the X and Y axis. Does anyone out there have any t
Electronics Forum | Fri Dec 10 01:02:36 EST 2010 | sparrow
Hello, our products are made on single-sided boards and we often have problems with receiving too warped PCBs from our suppliers. Can anybody suggest a good laminate or the most important properties of the material so we could specify it when we orde
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Thu Jun 28 16:55:45 EDT 2007 | hegemon
Hey Brian, Did you use the auto profile feature on your DRS25 machine to arrive at your profile? Our DRS25 has been doing quite well at larger BGA components. Most critical is a good preheat until the PCB reaches at least 140c, followed by a 2degC
Electronics Forum | Thu Jul 27 12:49:39 EDT 2006 | SWAG
We use same methods of PCB attachment to carrier as Rob lists. To be more specific on pocket size, we machine our durostone carriers so there is 0.010 inch gap around perimeter of board. This might seem like a lot but (from my experience) you will
Electronics Forum | Wed Jan 29 10:40:37 EST 2020 | tamasmagyar
Hi there, I used Grid-Lok and some other PCB support from Quik-Tool (don't ask me model :) ), which is pretty similar to Grid-Lok, in Viscom machines. We also had jigs for high volume products similar to those you would use for PCB routing, but with
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