Electronics Forum | Fri Apr 08 17:23:34 EDT 2005 | KEN
Warpage factors can cause: 1. Boards can not transfer down conveyor belts or wedge at transitions. 2. May not enter into machinery due to interferences (like board clamps) 3. May fall off conveyor chain in furnace. Especially true of thin (PCMCI
Electronics Forum | Wed Sep 15 13:55:06 EDT 2004 | dave
Due to some reason there are few balls of the BGA left open during the process. Reflow profile has been verified. There are other BGAs on the PCB and they are fine too. The BGA in question has a very large metal heat sink on top of it and is placed r
Electronics Forum | Fri Apr 25 14:14:48 EDT 2008 | blnorman
We just started having board warpage problems with one of our suppliers. The product has been in production for some time with no design changes, no material changes from the board supplier. Someone told me once that if the PCB cure was not corre
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
Electronics Forum | Fri Aug 28 15:39:14 EDT 1998 | smd
Does anyone know about the ANSI/IPC PCB warpage standard? What is the best way to determine weather boards are warped or not? What equipment works best? Or, is there a general rule of thumb that is also compliant with the standard? I would like to he
Electronics Forum | Fri Aug 28 16:24:56 EDT 1998 | Dave F
| Does anyone know about the ANSI/IPC PCB warpage standard? What is the best way to determine weather boards are warped or not? What equipment works best? Or, is there a general rule of thumb that is also compliant with the standard? I would like to
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
Electronics Forum | Thu Apr 07 14:07:11 EDT 2005 | Tater
Both methods are fine, but you should create or use a spec that fits your process needs. You should also consider if this warp will directly impact the performance of your final product once it's completely built. Then make sure your customer won't
Electronics Forum | Tue Sep 19 05:06:05 EDT 2017 | kubabel
Thank You for these hints, we´ve checked whole temp. profile (including dwelling time) and we follow all of specifications to components. Anyway we are still facing approx. once per two months issue with our customer, where only one BGA ball is nonwe
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
