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Electronics Forum | Fri Dec 08 12:38:51 EST 2000 | Andreas Foehrenbach
Hy all, i'm in need for some data about the electronics market: - general Industry Data of SMT and SMT Assembly - SMT-worlwide Production / Turnover - ratio of THT / SMT - Structure of productions cost (Parts, PCB-Assembly, Final Assembly, Investmen
Electronics Forum | Fri Dec 01 07:28:37 EST 2000 | JM Lasserre
I just started an analysis concerning broken capacitors (0603 ceramic). My first question concern the standard used to determine the maximum force a capacitor 0603 can support on a pcb. Some capacitors suppliers use the die sheer test of MIL-STD-883
Electronics Forum | Wed Nov 29 06:38:18 EST 2000 | Chris May
Dear People, Can anyone point me in the right direction. I am involved in manufacturing low volume (batches of 4-20) pcb's. I have been investigating Process Characterisation ref EIA/JEDEC PUBLICATION 132. For such a low volume scenario, has anyo
Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K
Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with
Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson
Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther
Electronics Forum | Mon Feb 05 11:45:07 EST 2001 | peterbarton
Phil, One source for this information is form the manufacturer Park/Nelco. They have a large website and give specifications for all sorts of laminates, including FR4. Try http://www.nelcointernational.com/parknelco/fr4epoxy.htm. I'm sure that ot
Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson
I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?
Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes
Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on
Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
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