Electronics Forum | Wed Dec 03 10:44:03 EST 2014 | kkay
We have a smt connector on side one of our pcb that overhangs through the board to the second side. We can't figure out how to print the second side with this part sticking out. Unfortunately we cannot run the second side first due to an LGA that has
Electronics Forum | Fri Feb 06 11:11:04 EST 2015 | mascott123
I have asked that same question to a co-chair of the J-STD-001 committee who in turn checked with personnel at IPC. The answer I received is that yes you can apply the Class 3 assembly requirements using a class 2 PWB but the resultant assembly will
Electronics Forum | Mon May 09 11:29:05 EDT 2016 | jpal
I wanted to bump this up. I am having the same problems. I cannot convince folks it is a solder mask issue and not our process issue, even though it shows up after wave and wash. I can heat the boards and even send them back through the wave preheate
Electronics Forum | Tue Feb 24 09:56:03 EST 2015 | akashicind
Hi, It depend on your budget,try to buy those maker can support spare & service . No meaning you buy high end machine but no service support. Try to find regional agent can support on call upon machine break down. Also other factor hand
Electronics Forum | Mon Feb 16 11:30:10 EST 2015 | clydestrum
Could anyone point me in the direction of finding out how much strength an SMT pad has in relation to being pulled away from the substrate/laminate? We are in process of trying to build a 6mil thick board and want to know if a chip can be placed onto
Electronics Forum | Mon Mar 23 15:46:23 EDT 2015 | g2garyg2
I have experience with Dual and triple lane production and perhaps can assist. I am on the PCB handling side so I am not vendor specific but more about good line flow. Many companies offer dual lane solutions today and for high volume automotive ther
Electronics Forum | Wed Mar 04 10:59:24 EST 2015 | jpierre
Hi first DS65 version is a specific dilution for dispensing machine, in this case the typical process is following: application of the conformal coating extraction of solvent (low extraction power is better)2minutes and drying the drying can be done
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Fri Mar 20 04:09:57 EDT 2015 | robertwillis
Yes generally speaking yes if there is not contamination on the board from PCB manufacture. for dendrite formation you also need moisture and voltage during operation of the product. You can see many of my IPC Defect of the Month videos at showing yo
Electronics Forum | Fri May 15 21:12:13 EDT 2015 | jlawson
As far as I know is pretty basic and only matches IPN to a feeder , does not offer serialisation of actual parts. For trace this is not accurate ie trace a btach to a work order to couple of PCB not possible. This may have changed in latest JUKI off
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