Electronics Forum: pcb and rework and enig (Page 1 of 3)

Pre- and post-reflow rework

Electronics Forum | Sat Feb 05 14:51:49 EST 2005 | etienne

One important thing to look at, when buying an AOI is the False Calls Rate, along with tact time of machine to inspect the PCB. Obviously, many machines can do the the work....but it's also true that each machine differ from the way it do the work. S

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:20:10 EST 1998 | Robin Arnold

Do you know if there is an IPC standard or industry standard that addresses the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development Harris Semiconduc

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:17:39 EST 1998 | Robin Arnold

Do you know if ther is an IPc standard or industry standard that addreese the issues regarding the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development

Re: uBGA rework and X-Ray inspection

Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro

Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve

Re: MSD in asembly and rework

Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader

| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har

Aluminum and silica contamination

Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch

Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F

Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F

Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one

Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

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