Electronics Forum: pcb baking after long storage (Page 1 of 6)

baking out pcbs after reflow process

Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1

I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r

Bare PCB baking

Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas

The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette

This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha

Has anyone looked into Vacuum storage on moisture sensitive devi

Electronics Forum | Tue Aug 19 09:09:15 EDT 2003 | D Peter

After a few problems and time constraints on baking moisture sensitive devices, we are looking at solutions to storage rather than going after a rebaking solution. One thing that always bothered me about baking was the oxidation on the lead finish,

PCB Baking after Wash

Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55

Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D

PCB Baking after Wash

Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55

SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma

PCBA delam after reflow

Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly

hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way

PCBA was swollen after SMD

Electronics Forum | Wed Aug 11 06:27:07 EDT 2021 | danisa

Hi all, The PCBA was swollen after SMD It is hard PCBA with 6 layers and SMD both sides Defect rate: ~ 5% Phenomenon: swell at the same side, same position (at 2 IC positions). Did not find any abnormality in SMD process as well as storage condition.

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

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