Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo
Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.
Electronics Forum | Fri Dec 27 16:26:30 EST 2013 | davef
I expect to find the specification and measurement method for the bow & twist of an assembly to be on the assembly drawing. Comments are: * Expecting that an industry committee to write a bow & twist spec for an assembly they know nothing about is n
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Tue Oct 31 20:54:12 EST 2006 | Joseph
Dear all, Do you know any simple method to measure the bending strain on a PCB. I have heard of something like a special tape that changes colour when bent. This can be stick to a PCB to find the bending stress/strain but I cannot find anything on t
Electronics Forum | Tue Oct 31 21:58:05 EST 2006 | davef
Initial thoughts are: * Strain gage http://www.omega.com/literature/transactions/volume3/strain.html http://www.vishay.com/brands/measurements_group/strain_gages/mm.htm * Moire interferometry http://www.buffalo.edu/news/fast-execute.cgi/article-pag
Electronics Forum | Sat Dec 10 07:33:09 EST 2005 | davef
Most board fabricators define a range of processes parameters that are routine for their plant set-up and methods. Look here http://www.divsys.com/ServicesProducts/PCB/MfgCapabilities.asp for an example. If you don't define your requirements, you'
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Tue Sep 01 20:43:06 EDT 2009 | davef
Please explain "adhesion of soldering is not uniform at the tips (soldering ends)." For example: * Is the "tips (soldering ends)" the component leads? * What is the component? * What is the finish on the component? * What process is causing this issu
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