Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Wed Nov 01 10:03:42 EST 2000 | Wolfgang Busko
Hi Adam, if your product needs the full width of your wave you won�t have any chance to adjust an angle. For smaller PCB�s you might consider having your carriers made in two pieces. One outer piece to match your transportionsystem and one inner cir
Electronics Forum | Tue Aug 21 12:57:49 EDT 2007 | ev
Looking for pointers. We have a semi-automatic SMT Techniques stencil printer. We have had some problems with a recent job. Problems were in the areas of finer pitch ics (paste voids as well as paste shorts and some smearing) in certain locations on
Electronics Forum | Tue Dec 11 17:31:41 EST 2001 | davef
This may be the part that Dave's talking about http://www.bce.it/Jst/eflz.pdf Why can't people use good ol' Cannon circular connectors.
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Thu Mar 14 09:07:26 EST 2002 | cfraser
I can not tell you what the actual stress limits are. I can tell you that de-paneling PCB's by hand is a very poor choice. I have seen numerous accounts of cracked caps, resistors, and LED�s due to incorrect de-paneling procedures. I would recommend
Electronics Forum | Mon Nov 12 19:02:48 EST 2012 | jmartens1978
My first attempt was similiar to that. It was a straight ground trace running past the circular pads that were recieving the shocks. It was hit and miss when the arcs would occur. When I cut notches in the trace so the ground line had a point next to
Electronics Forum | Wed Dec 06 05:50:42 EST 2023 | calebcsmt
For typical small sized circle LED panels, you can simply have a PCB routed to said circle... but when lighting fixtures are sizes 2-3 feet+, and a circular, typically how are the LEDs being spread across the radius? I can see flex LED strips being
Electronics Forum | Tue Feb 23 14:21:17 EST 1999 | Mike McMonagle
| A rash of new products here at my company have designs with multi-pin connectors 90 out-of-phase (orientation)wiht respect to wave direction, which has lead to massive bridging (shorts) problems.... | | Does anyone still use the 45 Degree Pallet
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
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