Electronics Forum | Thu Mar 20 14:17:39 EST 2003 | MA/NY DDave
Hi I don't think I will enter this too much except for one of your questions. YES multiple reflows affect reliability. Heck most everything affects reliability. Aggressive Heat cycles or Heat always affects the final MTBF reliability number. The
Electronics Forum | Thu May 02 20:56:25 EDT 2002 | clunier
I remember reading a magazine article a few years ago that discused using the copper area of a pcb to transfer heat away from large SMT devices. Does anyone know of this article or something similar that I can obtain. The article covered copper area,
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Thu Nov 05 20:53:37 EST 2015 | shuttlestar
It's a strange task . if your PCB is very very small ,using topside heat is not a big problem . but for a whole PCB board . if delete the step of preheat, it will broke the whole PCB . BTW,do you finish your task ?
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Mon Mar 30 12:52:45 EDT 2015 | grauen06
The PCB is in a housing when it is returned from the field and it takes 1.5 hours to remove the PCB from the housing so we are looking for a way to rework the BGA without removing it from the housing. Hence, top-side rework only.
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
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