Electronics Forum: pcb industry

Baking time for PCBA rework

Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette

Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite

Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process

5 Zone Reflow Oven

Electronics Forum | Mon Oct 26 13:38:35 EDT 2009 | davef

Type K thermocouples are the most commonly used in the electronics industry. There are various types of thermocouple types that can be used. Examples include [Ray Prasad]: • Type K ¾ nickel-chromium vs. nickel-aluminum (most commonly used); tempera

Wave Solder Test

Electronics Forum | Wed Jul 29 04:03:15 EDT 1998 | Bob Willis

The Reflow Soldering Interactive Test was well received in the industry with over 200 engineers testing their process knowledge. Now its time to take the Wave Soldering challenge and test you knowledge on soldering through hole and surface mount. Bot

Flex pcb carrier / palett

Electronics Forum | Sat Dec 01 15:07:46 EST 2012 | davef

I don't know of a Eurolander pallet source. If I was a Eurolander and wanted to find pallet suppliers, I'd call the suppliers of pallet materials and ask them which of their customers that I should consider. Durostone CCR/Durapol IGM L200/Glastic CB

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev

Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 07:01:26 EDT 2019 | charliedci

200uM seems high. I say this because typically our solder stencils in this application are between 80uM and 100uM thick which would leave the component height less than that after reflow. However if your not experiencing any shorting between pads I w

QFN standoff, industry standard

Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef

There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height

Re: the perfect SMT line configuration

Electronics Forum | Sat Sep 30 14:50:35 EDT 2000 | Elfego

Thanks for your replay,The line should be capable of making 200pc boards by hour 600 components by pc board,placing chips 0402 and IC's 144 pins 20 mils, also has to work 24 hours a day and 12 hrs saturdays and Sundays. these are products for the aut

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia

Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board

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