Electronics Forum: pcba and vacuum and seal and packing (Page 1 of 1)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

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