Electronics Forum | Mon Mar 08 09:42:22 EST 2004 | davef
Download J-STD-033 from the JEDEC web site.
Electronics Forum | Mon Mar 08 22:04:19 EST 2004 | pari
Dave i know abt the JEDEC033A specs..but this question is more of PCBA level. The baking temp and time at JEDEC is for MSD devices. I have tried to check IPC 7711 but the criteria does not mention the baking temp and time. Wandering is anyone is awar
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Wed May 15 19:55:19 EDT 2002 | russ
Good point, I am preheating for 90 sec to a temp of 170 C. (PCBA) then reflowing for 40 sec. to bring it to 215 C. I will try a softer hammer. This has been working on other assemblies with the same package however. Do you know if a water soluble
Electronics Forum | Thu Apr 01 11:53:33 EST 2004 | russ
You may want to tack a coup[le of leads first, making sure that the component is fully seated against the PCBA. Or what we do is apply solder to the E-Pad and the lead pads and then hit it with a "heat gun" until the solder melts on the E-Pad and th
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Tue Aug 31 07:51:45 EDT 2004 | Six Sigma QE
Our supplier is suggesting the 'removal and replacement' of programmable IC components to reduce cost. The removed components will be placed on other boards as well. Is there a risk in reworking programable IC components. Thank you.
Electronics Forum | Fri Sep 24 13:46:10 EDT 2004 | HOSS
Nick's point is well taken and quite true but finding reflow specs in an IC mfgr's datasheet is not very common. You may need to call the mfgr's tech support group.
Electronics Forum | Tue Aug 31 09:33:17 EDT 2004 | russ
there is always risk in rework, multiple heat cycles, overall temp, physical damage, etc... As far as I know the risks are the same with a programmed part as with any other part. If there is great concern or multiple rework actions you may want to