Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Thu Oct 01 20:11:31 EDT 1998 | Wayne Bracy
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Sep 30 15:27:26 EDT 1998 | Matthew Park
Very simple, you just buy a commerical-grade vacuum sealer. It's not that expensive. A small tabletop unit cost $2000 - $4000. I don't have a number handy. E-mail me off-line if you require more info. Regards Matthew NII, Norsat Internationa
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Jul 17 06:54:17 EDT 2013 | deanm
We manufacture according to military Class 3 standards and we do not vacuum seal any MSD devices. Your current method of dry packing is sufficient as well as dry cabinet or nitrogen storage. A light evacuation of air during the dry packing process
Electronics Forum | Fri Mar 19 13:18:03 EDT 2010 | deanm
Regarding your question about buying equipment to vacuum seal the MBBs, according to the IPC/JEDEC standard, "Full air evacuation is not needed or recommended; light air evacuation will reduce the packaging bulk and enhance carton packing. Excessive
Electronics Forum | Wed May 16 13:02:12 EDT 2007 | slthomas
Moisture barrier bags are polymer coated foil so are nearly gas impermeable. There's always some coating left at the weld (or it wouldn't stick) so they're not completely sealed but that's as good as it gets. Usually people use the vacuum to remove
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Fri Aug 25 07:42:29 EDT 2006 | davef
Our sympathies about the ENIG boards. B:) So, you cut the end off the barrier bag, take 200 boards, heat seal the end of the bag and restock it, build the 200 boards and ship them, right?
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
