Electronics Forum: pd and ag and soldering (Page 1 of 3)

RoHS solders and silver termination inks

Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted

Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h

RoHS solders and silver termination inks

Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine

we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma

Gold and Palladium Plating

Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef

ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef

You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef

EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2

Re: When? How and What??

Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee

The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef

Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit

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