Electronics Forum | Wed Apr 23 07:46:49 EDT 2003 | pbc1963
Bernard, The problem we have is when unloading the feeder several components may be lost due to the partial peel back of he cover tape. This area I am referencing just passed the point of the knife to the pick area. Also matching the correct feeder
Electronics Forum | Wed May 21 09:31:09 EDT 2003 | caldon
I need to first understand what "Peeled the BGA off" means. Was heat used? was this the pry and lift method? We had shorts under some BGA's we have and the solder was bridging from lead to lead but not on the board level at the FR4 on the BGA creati
Electronics Forum | Wed May 12 12:11:54 EDT 2004 | solderpro
Bruce, regards to all who are trying to help and have great input, with those type of lead length, I would be very impressed to see you get rid of the problem, and as the others said, no clean in a foam fluxer, not good but workable.... the real issu
Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas
I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it
Electronics Forum | Fri Jul 04 08:57:59 EDT 2003 | davef
If you think you have an intermetallic, soldering as probably done correctly. In that case, expect the solder to fail in the solder, just above the intermetallic. This the weakest portion of the solder, because the tin has be depleted to form the i
Electronics Forum | Wed Jul 09 09:27:02 EDT 2003 | MA/NY DDave
Hi Saw a Cross Section picture and thought of you You noted above that you couldn't find any pictures or descriptions of your problem in a few well known sources. It probably is not what you are experiencing yet a soldering defect called land lift
Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas
Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r
Electronics Forum | Mon Jul 14 16:26:58 EDT 2003 | slthomas
Yes, they do the cleaning, we did the (apparently first) inspection and caught the problems. They tried a shorter cleaning cycle, witnessed no defects, and attributed the defects on the boards we had to their cleaning process. Now they just plan on
Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas
It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in
Electronics Forum | Mon Jan 26 19:51:48 EST 2004 | davef
You should be able to obtain a smooth finish. A "glass-like finish" is in part a function of the coating material, assuming good process. When we see "orange peel" conformal coating, we think moisture from the spray room environment, conpressor, et
