Electronics Forum: peel strength (Page 1 of 4)

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Component Peel Strenght

Electronics Forum | Tue Oct 10 13:32:26 EDT 2006 | rsteele

Does anyone know of any tests or testing done on the peel strength of components to pads. I have alot of info on FAB level peel strength testing, but nothing on components themselves. Is there any process(es) to test and insure new pastes and reflo

Double-sided Adhesive with Different Peel Strength

Electronics Forum | Thu Apr 07 15:06:18 EDT 2022 | proceng1

Something like Tacsil tape?

Double-sided Adhesive with Different Peel Strength

Electronics Forum | Thu Apr 07 15:42:29 EDT 2022 | SMTA-69080803

@ProcEng1 Yes... something like that. However, how do I ensure that the adhesive will always stay on one material assuming that the surface area is the same?

Bare PCB baking

Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie

Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which

Component Peel Strenght

Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob

Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Bare PCB baking

Electronics Forum | Fri Nov 22 08:57:56 EST 2002 | davef

Q1: What do you mean by "if the board is manufactured properly"? A2: If the epoxy is noy cured prooperly, for instance, the copper will not be well attached to the glass. So, peel strength will be lower. Q2: I don't believe that the peel off/or lif

Moisture sensitive components (MSC)

Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette

To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive

chip components (i.e. inductor, capacitor & resistor) more than 2 years from packaging can still be used??

Electronics Forum | Fri May 23 19:59:26 EDT 2014 | jhaye

hi everyone, I just got some question with regards to the life span of components from the date it was packed from supplier. Does the parts more than 2 years from the date it was process by supplier: 1. Can it still be used in PCBA?? 2. will it not

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