Electronics Forum: pen and films (Page 1 of 3)

Headers and SMT

Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn

Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Re: Solder mask materials and equitements wanted

Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F

| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo

webcam self recording with memory and battery

Electronics Forum | Thu Nov 08 10:48:39 EST 2012 | Rui

Hi Skim, Have you found something? I'm also looking for something like that, a camera with battery and integral memory. I don't need anything with good quality, and if it could take pictures instead of filming it would be even better.

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen

| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S

Re: Printing and Reflow with Ceramics

Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon

| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther

Conductive contamination and the elusive solution

Electronics Forum | Thu Jul 12 16:57:46 EDT 2007 | jmelson

Canyou see this contamination? Is it solder beads, flux or something else? If flux, then more cleaning should help, either more time, more cycles through the cleaner, etc. If it is solder beads that are not melted to the rest of the solder, then s

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Green coating and through-hole plating

Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F

| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef

First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%

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