Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
Electronics Forum | Fri Apr 20 07:30:14 EDT 2001 | wbu
In short: the measured deviation / the length this deviation occurs * 100% = % of deviation Actually we encounter mostly "twist" so we put the board on a flat surface, hold it down at the corners to see if any of the corners lifts, measure the heig
Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning
I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
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