Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon
| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua
Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean
| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall
Electronics Forum | Fri Jan 08 10:11:15 EST 1999 | Tim
This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality
Electronics Forum | Mon May 26 19:25:47 EDT 2003 | bayanbaru
How many times can a populated board been reworked? What can go wrong (reliability) if the populated board is reworked more than 4 times?
Electronics Forum | Wed Feb 03 15:18:25 EST 1999 | Michael Allen
I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the part; th
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik
| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove
Electronics Forum | Tue May 27 19:21:50 EDT 2003 | bayanbaru
Can I then say that in general boards are not encourage to rework more than 3 times since the boards will be subjected to Top and Bottom reflow? What is 55110?
