Electronics Forum: percentages of reworks (Page 1 of 15)

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

Number of times reworking

Electronics Forum | Mon May 26 19:25:47 EDT 2003 | bayanbaru

How many times can a populated board been reworked? What can go wrong (reliability) if the populated board is reworked more than 4 times?

reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 10:11:15 EST 1999 | Tim

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality

Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 15:18:25 EST 1999 | Michael Allen

I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the part; th

Number of times reworking

Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef

Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove

Number of times reworking

Electronics Forum | Tue May 27 19:21:50 EDT 2003 | bayanbaru

Can I then say that in general boards are not encourage to rework more than 3 times since the boards will be subjected to Top and Bottom reflow? What is 55110?

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