Electronics Forum: phosphorous (Page 1 of 5)

ENIG CONTAMINATION

Electronics Forum | Tue Nov 03 17:52:05 EST 2009 | gregoryyork

Ask if they are seeing to much Phosphorous in the SEM or if they could determine if it is Phosphorous. Could be too much gold Brightener. Also this is not via in pad technology is it.

Re: Poor solderability

Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F

Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic

Does this forum covers BGA's

Electronics Forum | Tue Feb 22 09:01:50 EST 2005 | davef

It could be that you're starting with hyper corroded nickel, before you even begin work. With electroless nickel, everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive [during fabrication]. Immersion gold

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef

5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke

Lead free profile

Electronics Forum | Tue Feb 01 12:52:19 EST 2005 | jbrower

Hi Tom, I did talk to Bob Gilbert about the sn100c. His comment is that it is a nickle stabalized alloy. Simplisticly, the tin and copper molecules would rather bond with the nickle. He also mentioned that with the SAC alloys, the manufactuers were

Stainless Steel tabs in brd assemblies

Electronics Forum | Fri Jan 04 14:17:12 EST 2008 | ck_the_flip

So, I'd have to grind the living sh#t out of my wedding ring, and then use phosphoric acid based flux that can kill a small animal in order to solder stainless steel. Cool!

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 07:53:56 EST 2009 | tstrat

The phosphorous concentration was not elevated w.r.t. levels needed for black pad syndrome. It is not via-in-pad. The component on the board that has been failing is just a standard BGA.

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F

William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 06:23:06 EDT 1999 | Earl Moon

We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems wi

Re: Gold Immersion - Soft Joints

Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William

Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times

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