Electronics Forum | Fri Feb 15 01:44:15 EST 2008 | taimju
Hi, I have heard that some have added small amounts phosphorus to SAC alloy in wave soldering and this way decreased drossing. Does anyone experienced this with SN100C? Regards, Juha
Electronics Forum | Mon Feb 18 15:20:38 EST 2008 | davef
SN100C contains no phosphorus. It has a dross rate equal or lower than tin-lead solder, where as SAC drosses at 2 to 3 times the dross rate of tin-lead solder. Addition of solder dross inhibitors, such as phosphorus, can be effective inhibitors of
Electronics Forum | Thu Feb 21 06:31:20 EST 2008 | gregoryyork
We treat all our alloys with measured Phos additions. SAC alloys treated with Phos WILL/DO dross approximately half the amount of 63/37. Most Solder companies will not tell you this as they wish you to use more Solder. We are a Nitrogen Cast Solder p
Electronics Forum | Tue Nov 14 02:53:05 EST 2006 | saaitk
Thanks for your input folks. I will have to get back to our customer regarding the analysis as it was them that carried it out. If I can get more details then I will post them. For my own benefit, is phosphorus crystal formation to be expected using
Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat
I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif
Electronics Forum | Mon Nov 13 19:25:54 EST 2006 | greg york
do you mean too much gold brightener that dewetts solder???
Electronics Forum | Thu Apr 24 15:48:09 EDT 2003 | razor
Known: During PCB maufacting nickel alloys are used for corrosion resistance during gold immersion process. A nickel alloy with a high phosphorus concentration will cause a weak connection interface. Question: Is the concentration of phosphorus in ni
Electronics Forum | Mon Nov 13 07:04:59 EST 2006 | saaitk
We are having intermittent faults with BGA's soldered onto an immersion gold finish board with snpb solder. One potential cause I have been informed is the formation of phosphorus crystals. As I am not an expert in this area I have no idea if this is
Electronics Forum | Mon Nov 13 09:00:07 EST 2006 | pavel_murtishev
Good afternoon, 1. Never heard that phosphorus crystals formation creates difficulties with BGA soldering. Two points to check are reflow process and screen printing process. BGA package is designed to have extremely high yield. 2. Title: Reflow So
Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef
You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a
