Electronics Forum | Thu Sep 22 10:48:08 EDT 2005 | Rob
Cheers Greg, It's unusual to have such direct access to manufacturers & their opinions. I'll tell you what really does get us, and splicing doesn't work well on these occaisions - big SMD connectors, requiring deep pocket feeders. You only get m
Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Fri May 22 17:48:48 EDT 2015 | aemery
It's your first line, go with established manufacturers. Whether new or used it ultimately comes down to does the tool do the job and how well is it supported (labor/parts) if it does break down. I am a former field eng. with Speedline and now run
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 16 16:34:01 EST 2015 | rgduval
It's a four-spindle head. I've already learned the joys of the size of the nozzles...on a job that had an 0603 cap a bit too close to an SOIC. The first panel ran, and the cap placed after the IC...and I had parts everywhere. Got it figured out an
Electronics Forum | Wed Dec 06 16:34:59 EST 2000 | Ralph McDonald
I am the operations/production manager for a small contract manufactuer. I have recently taken the position with this company as well. I am searching for IPC Standards and info on ISO 9000 certification. I'm finding bits and pieces all over the pl
Electronics Forum | Thu Jul 11 20:36:43 EDT 2002 | cyber_wolf
It will place BGA's, but you will be centering by using the part outline. The IP2 cannot be adapted to do individual ball inspection.(You may already know this) As far as getting the part to stay on the part shuttle, I am sure that there is somethin
Electronics Forum | Mon Jul 17 13:36:55 EDT 2006 | kjeffries
I appreciate your comments regarding the programmability of the Mirtec. What type of SMT machine do you use? How easy have you found it to transfer the SMT profiles to the Mirtec? How do you rate the Mirtec in handling top/bottom, multi-panel asse
Electronics Forum | Fri Jan 16 12:57:33 EST 2015 | jax
The GSM can place the part from a XY positioning standpoint without issue. You'll have to look at what camera you have to know if the machine can inspect it. After that you need to decide if your feeders can accurately provide the part to the machine
Electronics Forum | Fri Jul 23 12:49:47 EDT 1999 | Tony
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
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