Electronics Forum: pick and place (Page 111 of 307)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan

Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Re: Farewell and thanks to all

Electronics Forum | Tue Sep 07 15:33:11 EDT 1999 | Earl Moon

| Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I e

Re: Farewell and thanks to all

Electronics Forum | Tue Sep 07 16:24:33 EDT 1999 | Jason Gregory

| | Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I

Re: Farewell and thanks to all

Electronics Forum | Wed Sep 08 02:24:32 EDT 1999 | P.L. Sorenson - Technical Consultant

| Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I e

Re: Farewell and thanks to all

Electronics Forum | Wed Sep 08 06:43:03 EDT 1999 | Wayne Bracy

| Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I e

Re: Farewell and thanks to all

Electronics Forum | Wed Sep 08 16:59:44 EDT 1999 | Carol Zhang

| | Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I

Re: Farewell and thanks to all

Electronics Forum | Wed Sep 08 17:02:39 EDT 1999 | Carol Zhang

| | | Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years.

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Paladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory

Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT


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