Electronics Forum | Wed Feb 13 09:51:14 EST 2013 | cnotebaert
Does anyone know of a masking material that could be applied over test pads that could be left on board that ICT test probes will pierce? could be tape or dispensed material. Thanks!!
Electronics Forum | Thu Sep 21 10:34:20 EDT 2006 | Kerwin Hooshey
Is there an ICT probe style that can pierce through tented (closed) via's?
Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave
Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s
Electronics Forum | Tue Sep 21 10:16:28 EDT 2004 | davef
Check with your connector supplier, but most press-fit contacts will pierce through Types UR & XY conformal coat (military approved). Acrylic (AR) Urethane (UR) Epoxy (ER) Silicone (SR) Parylene (XY)
Electronics Forum | Thu Apr 11 00:58:44 EDT 2019 | SMTA-Vikram
Thanks for info regarding rotating probe head. We do not recommending to use this probes as it may damage bare board as it will pierce thru board and will shorted etches.. Avoid using this probe for PWBA
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Mon Nov 20 11:58:16 EST 2006 | Rob
We try and do it all (Vac pack, dessicant, indicator card, MSL level, PBT, end termination material etc.) however it throws a spanner in the works if you pull a manufacturer's sealed pack from stock and the vacuum has gone where an edge of a tray has
winsouce.jpg)