Electronics Forum: pillow joint (Page 1 of 2)

BGA pads lifting from PCB

Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135

I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke

BGA pads lifting from PCB

Electronics Forum | Thu Jul 02 16:01:57 EDT 2009 | ewchong

thanks kpm. agree the cause of those pads lifting. all of them were no connects so they cannot be the cause of the electrical failure. when the bga was removed, all the solder balls on the pcb turned into conical shape due to the separation, except

Bad solder joints

Electronics Forum | Sat May 30 09:24:12 EDT 2009 | davef

head in pillow

Thermal screening for marginal BGA joints

Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau

Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe

BGA Placement Process

Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22

HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j

Altera PQFP240 Solderability

Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData

We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75

BGA drop off from the boards

Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah

Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the

Low Silver Solder Problems

Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo

Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca

Re: Altera PQFP240 Solderability

Electronics Forum | Tue Apr 14 09:38:07 EDT 1998 | Earl Moon

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

Re: Altera PQFP240 Solderability

Electronics Forum | Tue Apr 14 09:01:36 EDT 1998 | Justin Medernach

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

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