Electronics Forum | Tue Mar 09 14:22:09 EST 2004 | billschreiber
There is an article on our web site by Richard Clouthier, �SMT Stencil Cleaning: A Decision That Could Impact Production.� He talks about how high pressure sprays can damage the delicate land mass areas between fine-pitch apertures. High pressure ai
Electronics Forum | Sat Mar 20 08:37:06 EST 2004 | Primus
The BioAct SC-10 wipes work great, but I've noticed some contamination in our solder joints after I began using them on the stencils. After cleaning the paste off the stencil with the wipes, I started spraying the stencil down with isoproponal and bl
Electronics Forum | Fri Mar 19 12:09:17 EST 2004 | Primus
I'm just getting more involved with SMT, as I've been a through-hole operator for years. But I don't understand how one could reflow SMT components AFTER the through-hole insertion and solder wave are finished. How does one print paste over a board w
Electronics Forum | Tue Apr 13 13:01:01 EDT 2004 | arcandspark
These voids only appear in the solder connections that have a (via in pad). The pads that do not have (via in pad) do not have any voids. Profile is 60 seconds above 183 C and peak of 218 C. The BGA is an OMAP lead free,I am using standard eutectic s
Electronics Forum | Sun Feb 26 17:40:35 EST 2006 | GS
Hi, just my comment, theoretically No Clean means no Ion Contaminants from Flux, but it some some case ion contamination (Cl-Br-F) could come out from raw PCBs, from Components, from fingerprints, etc. To incorporate a ROSE step in the pro
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
Electronics Forum | Fri Jun 30 20:39:52 EDT 2006 | johnwnz
Grant, Haven't doen any work with the SN100C paste, the problem I guess is yoru subject to the suppliers flux base so if that is poor then the alloy may not perform as well as it could. We've found Avantec to be pretty good at SMT but have got SN100C
Electronics Forum | Fri Jun 16 15:05:29 EDT 2006 | grantp
Hi, We ran some boards and the girl on the line put in some Pb BGA's instead of using RoHS parts. This should not have happened as we have almost no Pb parts left, and we spray painted Pb parts fluorescent pink so it was obvious. The boards seem t
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
