Electronics Forum: pin (Page 101 of 229)

Re: On Board Forum with Bob Willis

Electronics Forum | Mon Jul 10 15:03:52 EDT 2000 | Michael Bryant

Just to reiterate what Bob said, we are very excited about his OnBoard Forum on July 20th. If you haven't signed up yet, I have included the Web address at the bottom of this message. Topics for this forum include Pin In Hole Reflow, Bob's process of

Re: Skewing chip components

Electronics Forum | Fri Jun 23 10:00:08 EDT 2000 | Chrys Shea

Yeah, them soldering machines sure got some demons in them...My waves used to get blamed for wrong polarities all the time. Sneaky little devils used to pull components out of the boards, flip them around, and get the pins back in the holes while

Re: Fine pitch SMT connector reflow

Electronics Forum | Mon Jun 05 10:32:39 EDT 2000 | Khalid Saeed

It could be a gold finish problem. The recommened gold finish thickness is less than five micro inches. Gold thickness greater than five microi inches is significant contributor for causing embrittlement of the solder joints. Verify the reflow profil

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

intrusive reflow with OA paste

Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK

Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e

The bent ones.......

Electronics Forum | Tue May 02 16:33:18 EDT 2000 | Joe

hi, I am looking for some guidelines which can tell me when gullwing and finepitch leads are too damamged to repair. Copper gets hard when bent and the electrical resistance increases. When a finepitch component gets dropped a lot of pins need staig

footprint formula

Electronics Forum | Thu Mar 02 09:13:07 EST 2000 | jacqueline Coia

Could anyone please tell me if there is a quick simple formula for working out the ideal SMD footprint for a 52 pin QFP using the dimensions specified on the manunfacturers component drawing. I know of the IPC 'SMD land patterns' standard, which I e

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

Re: Stencil printers, what's really out there?

Electronics Forum | Tue Feb 22 19:21:05 EST 2000 | Peter

I like MPM's 500 machine. I purchased the predecessor model when it was made by SMTech. This machine has programmable pin supports which made setting up for double sided boards really easy. For auto alignment, I think only in-line machines have th

Looking for IPC or other standard for electronics / electro-mech

Electronics Forum | Fri May 04 18:24:48 EDT 2001 | ashokdha

I am looking for an IPC Standard (s) or other standard (s) for electronics assemblies. The kind of operations involved are riveting, assembly of backpanels and circuit cards into metal shelf, wire wrap , soldering , contact pins , cabling etc.


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