Electronics Forum | Sat Jul 29 00:44:30 EDT 2000 | Jason
Thanks for all the ideas. I tried solder "thieves" by placing some desoldering wick behind the briging pins and it worked! I have yet to try Chrys' idea but I will first thing Monday. This is a new board that has had this problem from day one. I
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Tue May 30 21:14:31 EDT 2000 | Dave F
Sal: JAX makes good points, but I�d like to think about this differently. It sounds like the poorly soldered connection is lifting the whole connector, so that termination floats on top of the solder, rather than submit to the wetting force and be
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Fri Apr 14 04:31:12 EDT 2000 | pascal MATHIEU
Hi Kevin , we use frequently double reflow + selective soldering after , and try to avoid the glue process as much as possible because that 's not very reliable process in comparison to reflow process . We begin now to work on PTH components soldered
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef
Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature
Electronics Forum | Thu Mar 22 21:10:42 EST 2001 | dblsixes
Ah ha! ... You hit upon something that I discovered earlier today ... As I said in an earlier post, I was going to experiment with dog-boning the solder paste ... But upon further review, I discovered that our customer removed 75% of the pad behind t
Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we