Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Mon Jun 14 09:16:54 EDT 1999 | C.K.
| Dear All, | | We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We are ty
Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu Jun 03 16:12:24 EDT 1999 | Earl Moon
.020" pitch spacing. Which have yielded my process excelent results. | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | Hope this helps. | | Deon Nungaray | SM
Electronics Forum | Thu Jun 03 18:00:33 EDT 1999 | John Thorup
.020" pitch spacing. Which have yielded my process excelent results. | | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | | Hope this helps. | | | | Deon Nunga
Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien
| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca
Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa