Electronics Forum | Wed Sep 02 11:52:40 EDT 1998 | Dick Casagrande
We are investigating equipment for a new SMT line. We are an OEM doing thru hole assembly and now must decide whether to do SM assembly in house or sub-contract out. We are a low volume/high board mix company. Our boards are mixed tech with SM on bot
Electronics Forum | Sun Sep 06 12:46:22 EDT 1998 | Phillip Hunter
| We are investigating equipment for a new SMT line. We are an OEM doing thru hole assembly and now must decide whether to do SM assembly in house or sub-contract out. We are a low volume/high board mix company. | Our boards are mixed tech with SM on
Electronics Forum | Fri Aug 28 11:14:46 EDT 1998 | Justin Medernach
| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa
Electronics Forum | Thu Aug 27 13:56:27 EDT 1998 | Stefan Witte
| Where can I find a good tool to splice 8mm and 12mm paper and plastic part carrier tapes together? Siemens has a pretty good splice tool, which crimps a small brass strip into the tape. The cover tape has to be sticked together with a small strip o
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Thu Jul 23 07:33:28 EDT 1998 | The Wretched SMD
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother with 04
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Mon Jul 20 15:11:34 EDT 1998 | Scott McKee
| QFP's are best left the professionals. There are MANY subtle issues with fine pitch lead forming such as critical tool design issues ability to check critical dimensions etc. Unless you want to replow this grown in hopes of getting a promotion or
Electronics Forum | Tue Jul 14 10:23:42 EDT 1998 | justin medernach
| Hi all, | We are currently having problems with a laser-cut stencil that is | electropolished and nickel plated with 9-mil openings. The paste does | not release well from the apertures. We are having to wipe after every | print. The board is fixtu
Electronics Forum | Thu Jun 25 21:13:11 EDT 1998 | Phillip Hunter
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Print speed is determined by your aperture dimensions, paste viscosity type of blade (metal
