Electronics Forum | Tue Jan 04 15:38:19 EST 2000 | Pat Pepper
Hi everyone: Our company is trying out immersion white tin for fine pitch assembly with what I would call mixed results. Reflow solder looks very good, but wave solder looks somewhat grainy (this may not be a problem in actuality). We had dewettin
Electronics Forum | Fri Dec 17 16:07:07 EST 1999 | Alex B
Hi, C.K. Let's assume that your stencil's thickness is in a range 4-6 mil or by other words the height of the solder paste on a pads is the same (close enough to reality) Therefore, for pad's width more than 20 mils(as well as pitch between pads) th
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Wed Aug 18 17:59:09 EDT 1999 | Mik Horvath
| | Hi, | | I'd like to ask some tips about the merits and shortcomings o | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | application? | | The boards contain
Electronics Forum | Wed Aug 18 18:10:33 EDT 1999 | Mik Horvath
| | Hi, | | I'd like to ask some tips about the merits and shortcomings o | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | application? | | The boards contain
Electronics Forum | Fri Aug 13 13:38:23 EDT 1999 | Bian Wycoff
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I have used thetechnique extensiv
Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Thu Aug 05 13:23:10 EDT 1999 | JS
| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.
Electronics Forum | Tue Jul 13 16:50:20 EDT 1999 | Boca
| We are looking to automate the paste printing portion of our SMT process. We are looking at used equipment from DEK and MPM from 1994 onward.(DEK 260 & 265 MPM AP20 & AP27) Does anyone have some feedback or concerns with any of these machines? Does
Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
