Electronics Forum | Mon Oct 26 20:04:23 EST 1998 | Dave F
| Hi, | | My question is how close can you place smd 0603 chip resistors to each other with having an assembly problem? | I know the pick and place machines don't need a lot of clearance, Iam more concerned about the court yard area around the com
Electronics Forum | Mon Oct 26 11:11:48 EST 1998 | John Hardy
We have installed a Sonoflux atomized mist fluxing unit (Model 9500)on our Future 1 wave solder machine. We are concerned that the retrofitting of this unit may not have been appropriate for our equipment, as we are now experiencing many problems wi
Electronics Forum | Mon Oct 26 20:18:23 EST 1998 | Dave f
| I need some info on how to stop the bridges I'm having on | radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot, an
Electronics Forum | Fri Oct 23 09:29:29 EDT 1998 | Allen
We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good but
Electronics Forum | Fri Oct 23 14:58:40 EDT 1998 | Dave F
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Fri Oct 23 15:19:38 EDT 1998 | Dave f
| Hello : | Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. M
Electronics Forum | Wed Sep 16 10:35:45 EDT 1998 | John McMasters
| | Has anyone used Fuji's rubber tip nozzles for the IP3? Are they O-ring type or suction cup? I'm having trouble picking up Ompacs due to the top of the part not consistently being flat. Any actual experience with these $1100 nozzles would be app
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Thu Jul 23 07:33:28 EDT 1998 | The Wretched SMD
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother with 04
