Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
Electronics Forum | Sun Jul 07 08:45:07 EDT 2002 | davef
Peter Roth of Bosch kindly translated from German a University of Stuttgart presentation on the environmental cost of lead free solders. (Thanks, Peter). The original authors approved this translation. Brian Ellis placed the translated document at h
Electronics Forum | Thu Jul 11 20:36:43 EDT 2002 | cyber_wolf
It will place BGA's, but you will be centering by using the part outline. The IP2 cannot be adapted to do individual ball inspection.(You may already know this) As far as getting the part to stay on the part shuttle, I am sure that there is somethin
Electronics Forum | Tue Jul 30 14:07:01 EDT 2002 | cnoonan
Slim KIC would be my choice out of these two vendors. I have worked with several different makes and models and I would say DataPaq was my favorite. But it all depends on your needs and budget. They can all get the job done. Good luck with your
Electronics Forum | Thu Aug 01 15:50:15 EDT 2002 | pjc
I had a 1995 SENSBEY MXL-400J at the last place I worked. I had very good results- easy to setup, run and maintain. It has a paint gun type spray head. Good idea to have spares cause they can clog. I sprayed a Multicore NC flux. Only downer was a fai
Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc
What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG
Electronics Forum | Mon Aug 12 14:47:01 EDT 2002 | soupatech
Hi, Does anyone know the aprox. parts per hour a cp3 and ip2 should place assuming the program is optimized and everything else goes well (yeah right!)? I understand there are a lot of factors involved to get the correct numbers but what is the BEST
Electronics Forum | Tue Aug 13 13:47:58 EDT 2002 | cnoonan
To Everyone, Does anyone need someone that has process engineering, programming and/or experience maintaining SMT&PTH equipment? Send me an email and I will forward you my resume... I have worked with Fuji, Universal & Siemens pick and place as
Electronics Forum | Wed Aug 21 20:07:51 EDT 2002 | S.Evers
Fritch: http://www.fritschusa.com APS: http://www.apsgold.com MannCorp: http://www.manncorp.com Advanced Techniques: http://www.atco-us.com All of these companies make or sell manual vacuum aided assembly systems which will address your low end asse
