Electronics Forum: placed (Page 431 of 787)

removing solder from a 0.015

Electronics Forum | Wed Feb 26 21:21:34 EST 2003 | davef

Try this: * Lay the board onto a solder pot with the via in question on the heat. * Push the wire into the via. * Step back and pat yourself on the back. Since you probably have components in the area of the via that you don't want to cook, try a va

Back-side 150p SMD connector

Electronics Forum | Fri Feb 28 13:09:49 EST 2003 | russ

Check out out hot bar equipment, we used to do this with very good results. I am sorry that I can't remember the manufacturer to help you check into this. If you are not familiar with this here is the process in a nutshell, place assy and connector

Plating for aluminum wire bonding

Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave

Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think

What are decoupling capacitors?

Electronics Forum | Mon Mar 03 11:23:04 EST 2003 | MA/NY DDave

Hi If you don't know what these puppies are, HAVE the customer specify them. You will be MUCH Safer in the long run since if you choose the wrong value they will COME Back at YOU. He might even need a network of .1 .01 Piles of places to read; Bo

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing

Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your

Hall IC Placement (Support with PWB Carrier)

Electronics Forum | Thu Mar 06 09:34:56 EST 2003 | msivigny

Hello Joseph, I'll be honest, I'm finding it a bit difficult to understand and visualize the complete scenario. If this component is designed for surface mount placement into a slot on a PCB, then why does it even need support from the bottom side? I

Why measure O2 ppm level in N2 environment

Electronics Forum | Wed Mar 05 08:12:56 EST 2003 | nifhail

Hi Mike, How do we measure the O2 ppm in N2 environment. I don't understand why the customer keep insisting me to use N2 instead of Air. I don't see the need for it as I done have any soldering issue. Can you share with me why N2 is needed at the fi

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Mon Mar 10 15:20:41 EST 2003 | MA/NY DDave

Hi Well I don't have all the titles right handy, yet let me give a few places for you to check. All my books aren't exactly at my finger tips. Author: Tumalla (??spelling) He is now at Georgia Tech Author: Lasky, Seraphim Author: Ning-Cheng Lee or

AOI, Pre or Post Reflow?

Electronics Forum | Tue Mar 11 12:43:27 EST 2003 | MA/NY DDave

Hey Frank, We got lucky. An article just appeared in one of our industry's magazines. Now you still have to read these articles carefully since the proponents sell the equipment yet it does support both opinions. Except it says (before PnP) and (p

TOMBSTONE DEFECTS

Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas

I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to


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