Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Mon Apr 16 10:16:01 EDT 2001 | pteerink
Been there, done that, don't wanna do it again..... Was lucky enuf one time to recieve a customer PCB ( we were a contract house, nuff said...) where the PCB designer had decided to put vias in the pads of a QFP80. Probably don't hafta tell you that
Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223
Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ
Electronics Forum | Mon Apr 23 22:48:50 EDT 2001 | davef
Cal is correct. Sipad, Precision Pad, Optipad, SSD, and all that were a feeble Euroland approach to creating flat pads for fine pitch assembly. To begin with, they required a complete board redesign using their proprietary software. [Oooo, me firs
Electronics Forum | Tue Apr 24 08:31:36 EDT 2001 | davef
First, you found THE place already!!! Read the Archives, current and previous Newsletters, technical papers, terms & definitions, etc Second, magazines ... Assembly magazines http://smt.pennnet.com/home.cfm http://www.cassembly.com/ http://www.ep
Electronics Forum | Wed Apr 25 16:35:55 EDT 2001 | Steve
Most of the time, we have very few skewed parts so I feel comfortable about the processes in general. However once in a while, often enough to throw off the first pass yield, we will get a few boards with a lot of skewed parts. By skewed I mean that
Electronics Forum | Thu Jul 20 13:58:47 EDT 2000 | Bob Willis
Well you can do both but why clinch the leads ? You are not referring to the SPOT process my friends at Camelot talked about some years back are you ? You can dispense paste but it�s a lot slower than printing. You can select a pin and dispense dire
Electronics Forum | Thu Jul 20 17:03:09 EDT 2000 | Darby
Ketan, If you are using a z-axis head, pay very careful attention to the pick up height so that you don't force the head into the component. Also pay very careful attention to the placement height, we set the component height to 0.05 to 0.1mm over th
Electronics Forum | Tue May 22 23:49:58 EDT 2001 | jones
I've never tracked the life of a stencil, but if your seeing an decrease in the life of your stencil you may want to look at the printer itself. What kind of printers are you using? I'm more familiar with MPM screen printers and I have seen were cert