Electronics Forum: placed (Page 656 of 787)

Re: Programming with F4G

Electronics Forum | Wed Sep 08 23:36:12 EDT 1999 | Jason Tomlinson

| | | Dear all, | | | | | | I don't know if I'm asking at the right place here, since you all seem to be more focused on process problems then programming problems (or perhaps programming isn't a problem for you). | | | | | | I'm using FUJI CP642's

Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 07:11:12 EDT 1999 | Earl Moon

Ladies and Gentlemen, As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous insigh

Re: Suspected Pink Ring

Electronics Forum | Wed Jul 28 12:02:48 EDT 1999 | Wolfgang Busko

| | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That wou

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 23:47:03 EDT 1999 | Scott McKee

| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Re: SMD Inspection and Touch-up

Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee

| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon

| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox

| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 09:33:11 EDT 1999 | Earl Moon

| | | | | | snip | | | | | | | John and Dave, | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do t

Re: vibration during solder reflow

Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook

| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon

| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo


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