Electronics Forum | Mon Oct 15 23:30:35 EDT 2001 | Ivan Rojas
Well Dave ,,, ,, first thing I should do ,, is check my CAD data , and make sure match with the program in the pick and place machine ,, right now I work with Siemens and GC-Place ,,, In my case it may be other things to look for ,,, if is everythin
Electronics Forum | Mon Oct 29 15:58:47 EST 2001 | davef
Kitting: Buy-in material in kit form that is complete and in the proper form. Line set-up: Layout all boards to be the same width. Printer set-up: Use a dispenser, instead of a printer. Dispenser set-up: Program & debug off-line. Placement machin
Electronics Forum | Fri Nov 09 20:33:28 EST 2001 | caldon
There is two directions I see here...1) you are looking for a bid comaprison or 2) you are going to build boards with the machines you cause they are not being used in full capasity. Some OEMs and/or CEMs charge extra for "cut tape" (Not full reel)c
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
Electronics Forum | Sat Aug 10 06:38:25 EDT 2002 | jojojameson
Dear Freinds, We are having 18000 sqfeet airconditioned space for pcb contract manufacturing.We had chipschooters,through hole machines & fine pitch placement machines with international standard.In addtion we had clean rooms & wire bond facilities.W
Electronics Forum | Mon Jan 14 15:15:25 EST 2002 | burb1999
Currently our company is in the process of putting together a SMT prototype line... I have experience with fuji, universal, DEK, MPM, BTU, Electrovet in a high volume application. Now with prototype builds we have narrowed down a few and would like
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick
The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else
Electronics Forum | Sun Feb 24 13:52:47 EST 2002 | bentzen
Hi Armin Printing equipment can be divided into two main groups; In-line and off-line. For "small" production sites an off-line screen printer should be adequate but for high out-put placement lines, where the product cycle-time is short, an in-line
Electronics Forum | Wed Feb 27 14:07:25 EST 2002 | Stefan
In order to kiss off the components with an air blow, there are two times to consider: 1. reaction time of the solenoid ( to shut off the vacuum and turn on the air ), 5-10 ms 2. time required to fill up an air hose, which leads to the nozzle. Assumi
