Electronics Forum | Fri Mar 24 10:26:45 EST 2000 | Russ
Sal, Interesting problem, I have found that W.S. pastes tend to have a shorter tack time in real life than what is advertised. Usually the manufacturers specify tack time as after placement let the board sit and then turn it upside down and see if
Electronics Forum | Thu Dec 16 20:55:09 EST 1999 | TNT
Hey Henry, Tombstoning can result from many different conditions: 1. Look at the part placement under a microscope before the board has been reflowed. Is it centered perfectly on the pads? If not, the part might migrate towards one pad during reflow
Electronics Forum | Mon Mar 15 13:33:46 EST 1999 | Stefan Witte
| Is there anyone know where to get information on PIck & Place equipment Program optimisation ( to improve the speed of component placement for boards). Thank you | Program optimization usually includes set up optimization for the feeder table(s) a
Electronics Forum | Thu Mar 04 12:44:01 EST 1999 | SMTASSY
Hi, For hand placement you should see about 150-200 ppm of errors (solder, placement, values etc) on a board populated of types such as 1206, 0805, SOT, Tantalum etc. . As for solely wrong components (component at wrong location) you can usualy redu
Electronics Forum | Tue Nov 17 15:20:41 EST 1998 | Dave F
| I am interseted in an entry level placement machine and looking for opinions and advice on manufacturers. My present line, an MPI-580 just became obsolete due to a bankruptcy situation! I need to place BGA and 20 mil fine pitch, speed is not too
Electronics Forum | Mon Oct 05 21:05:32 EDT 1998 | Stefan Witte
Most of the older placement machines might not have a 2mm advancing feeder. Here is how I get by picking from a 8 mm feeder without loosing every second component. 1. Define a second component in the BOM. 2. Define this component in the feeder set up
Electronics Forum | Wed Oct 07 21:53:47 EDT 1998 | Dave F
| Most of the older placement machines might not have a 2mm advancing feeder. | Here is how I get by picking from a 8 mm feeder without loosing every second component. | 1. Define a second component in the BOM. | 2. Define this component in the feede
Electronics Forum | Wed Sep 09 20:07:41 EDT 1998 | Dave F
| I am attempting to locate a kit to be used on surface mount equipment to determine the placement capability (CPk). Does anyone have information on where to purchase such a kit? Ideally this kit should be usable on placement equipment from various
Electronics Forum | Wed Sep 09 03:54:20 EDT 1998 | Brian McKenne
Mike, My company purchased a kit called Accuspec to try on our equipment (Panasonic's and Philips Topaz.) The kit works well with equipment that allows a fixed point for pickup. For chipshooters, we were totally out of luck. The kit itself, provides
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.