Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Thu Jan 23 08:43:30 EST 2003 | MA/NY DDave
Hi I prefer reading piles of stuff from many sources, yet George does a reasonable job. DrFlipChip.com I understand the next SMTA in Boston will cover this and their are other web sites. YiE, DDave
Electronics Forum | Thu Jan 23 08:45:53 EST 2003 | MA/NY DDave
Oops, I used his consulting web site. Also try plain FlipChip.com. Gee I should have trusted my memory. YiE, DDave
Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto
Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it
Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe
Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a
Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station
This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul
Electronics Forum | Fri May 23 12:18:59 EDT 2003 | vortex
First off is your CP4 0402 ready? Before we could begin placing 0402's we had to have a vision upgrade. Once you have that or are sure your machine can handle 0402 then you will have to get 8x2 feeders. There may be a way to rig an 8x4 feeder but i'm
Electronics Forum | Fri May 23 07:07:39 EDT 2003 | qp1
Please your comments for placing 0402 on CP4? Which are the difficulties to expect and how to threat them? How to adapt the feeders for the smaller interdistance of the tape?? Thanks
