Electronics Forum: placment and force (Page 1 of 7)

force between the pad and laminate material

Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao

I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame

force between the pad and laminate material

Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao

Thank you very much!

force between the pad and laminate material

Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul

I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.

force between the pad and laminate material

Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao

according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

force between the pad and laminate material

Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny

When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 16:02:53 EST 2003 | Dave C.

We have auto-correct funtion on our Panasonic Create CM-301 placement machines but have never turned it on because of a perceived loss of placement time when the camera verifies placement. We look at the first article and correct placemnt if needed.

Pick and placement forces

Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station

This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul

SMT optimization and improvement

Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC

Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,

Pick and placement forces

Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe

Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a

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