Electronics Forum | Wed Apr 12 11:06:05 EDT 2006 | pavel_murtishev
Good afternoon, I'm very sorry for commercial post, but... We are seeking for supplier of used equipment for planar technological process (equipment for producing of microelectronic chips) in the US. Please let me know if you know anyone. Thanks in
Electronics Forum | Wed May 16 02:59:53 EDT 2007 | pavel_murtishev
Good morning, What kind of placement equipment do you use? Many of placement machines have co-planarity check sensors. Switch them on. BR, Pavel
Electronics Forum | Fri Oct 01 13:09:18 EDT 2010 | clampron
Good Afternoon, How is the stiffener adheared? If it is laminated to the flex, it may help you with the surface planarity through reflow. If it put on with PSA, it may cause more problems then it would solve. PSA gets soft through the reflow. It may
Electronics Forum | Mon Apr 09 11:39:32 EDT 2018 | emeto
The easiest way to do without special tools is to use level. Check machine co-planarity on the conveyor rails in both directions(you can do that with rails down or rails up or both). Then check co-planarity on the stencil. If the level shows the sam
Electronics Forum | Thu May 18 20:47:14 EDT 2000 | Dave F
Ed: It might be possible, never tried tho, but if an engineer wandered in, talking about it ... Printing: Makes me pretty nervous, because punched boards are not planar, don�t stay planar, and are inconsistently not planar. If I could work-out th
Electronics Forum | Wed Dec 15 10:09:29 EST 1999 | Karl
CoPlanarity also applies to height.
Electronics Forum | Tue Aug 15 08:38:59 EDT 2006 | John N
Thanks guys.
Electronics Forum | Mon May 14 22:53:12 EDT 2007 | davef
What is it about your incoming inspection procedures that allow these components to your assembly area?
Electronics Forum | Fri May 07 20:08:39 EDT 2004 | Ken
...um also, don't forget that ther are planarity issues associated with BGA devices AND bow-and-twist issues with PCB materials. An example I have one BGA device that has a ball planarity of 7 mils!!! Ant that's the OEM specification! THis will re
Electronics Forum | Mon Aug 14 08:18:24 EDT 2006 | John N.
Hi all, I work for a service company who do SMT repairs for a Blue Chip. The JEDEC standard doesn't seem to mention how long (if at all) you should bake a planar after placing a new BGA (after field failure). Any ideas? Thanks in advance. regards Joh
