Folysky Technology(Wuhan)Co.,Ltd, is a professional engaged in the plane and three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production and sales of high-tech ent
New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl
on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2008-11-07 00:32:07.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces Anritsu, a new 3-D High Precision Laser In-Line Inspection System.
Industry News | 2009-02-21 16:03:08.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces a successful appearance for the Anritsu at the 39th Annual Internepcon Japan, Asia's largest exhibition featuring a large variety of equipment, materials, and technologies for electronics manufacturing and SMT. The show was held January 28-30, 2009 at the Tokyo Big Sight in Japan.
J7154051A Lower plane component SUB PLANE-40X original J7154051A Lower plane component SUB PLANE-40X original Email:firstname.lastname@example.org Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
03040316-01 Video multiplexer Complete 03040417-01 CABLE Interface Portal 1 oder 3 03040418-01 CABLE Interface Portal 2 oder 4 03040460-01 Vision Board D-Series complete 03040461-01 Retrofitkit DLM head (SMboard,CAN,fw,..) 03
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production
• Excellent Analytical, inter-personal and communication skills • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti
. The 3600 watt Rapid-IR underheater is a critical feature to rework large PCB's with many layers or heavy ground planes. Features: High Resolution 2 Mega Pixel HDMI Vision System Fits Boards up to 25" or upgradabe to 36" Places components from
Automática CircuitCam Express Multi Job Optimiser Multi Job Optimiser Nuestra opción de optimización (Multi job optimiser) de múltiples órdenes de trabajo crea planes de carga comunes para grupos de trabajos, minimiza los cambios del alimentador, reduce significativamente los tiempos de cambio de productos y mejora el rendimiento