Industry Directory: planes (11)

Foxconn

Industry Directory |

Back-Plane and NPI SMT applications.

Folysky Technology(Wuhan)Co.,Ltd

Industry Directory | Manufacturer of Bare PCBs

Folysky Technology(Wuhan)Co.,Ltd, is a professional engaged in the plane and three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production and sales of high-tech ent

New SMT Equipment: planes (657)

MX-5250 Dual Port Simultaneous Desoldering System

MX-5250 Dual Port Simultaneous Desoldering System

New Equipment | Rework & Repair Equipment

New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta

Metcal

Rework and Repair Services

Rework and Repair Services

New Equipment | Rework & Repair Services

In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur

ACI Technologies, Inc.

Electronics Forum: planes (396)

Barrel fill with Pb Free Wave Solder

Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl

on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev

QFN Side fillet

Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef

IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -

Used SMT Equipment: planes (17)

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

Used SMT Equipment | Pick and Place/Feeders

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Dage XD7600NT Diamond

Dage XD7600NT Diamond

Used SMT Equipment | X-Ray Inspection

Running time according to clock is 3840, 5 hours Includes X-plane option.

Privalar OÜ

Industry News: planes (141)

Seika Machinery, Inc. Premiers 3-D High Precision Laser In-Line Inspection System

Industry News | 2008-11-07 00:32:07.0

TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces Anritsu, a new 3-D High Precision Laser In-Line Inspection System.

Seika Machinery, Inc.

Seika Machinery Announces Success for the Anritsu at Internepcon Japan

Industry News | 2009-02-21 16:03:08.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces a successful appearance for the Anritsu at the 39th Annual Internepcon Japan, Asia's largest exhibition featuring a large variety of equipment, materials, and technologies for electronics manufacturing and SMT. The show was held January 28-30, 2009 at the Tokyo Big Sight in Japan.

Seika Machinery, Inc.

Parts & Supplies: planes (508)

Samsung J7154051A Lower plane component SUB PLANE-40X original

Samsung J7154051A Lower plane component SUB PLANE-40X original

Parts & Supplies | Assembly Accessories

J7154051A Lower plane component SUB PLANE-40X original J7154051A Lower plane component SUB PLANE-40X original Email:info@smtlinemachine.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com

CNSMT CO.LTD

Technical Library: planes (174)

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: planes (24)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Siemens SMT spare parts Distributor piece 00319827S02

Videos

03040316-01 Video multiplexer Complete     03040417-01 CABLE Interface Portal 1 oder 3     03040418-01 CABLE Interface Portal 2 oder 4     03040460-01 Vision Board D-Series complete     03040461-01 Retrofitkit DLM head (SMboard,CAN,fw,..)     03

Qinyi Electronics Co.,Ltd

Training Courses: planes (3)

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

Blackfox Training Institute, LLC

Soldering 101

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: planes (8)

Soldering 101

Events Calendar | Wed Jul 01 00:00:00 EDT 2015 - Thu Jul 02 00:00:00 EDT 2015 | Chicago, Illinois USA

Soldering 101

BEST Inc.

Soldering 101

Events Calendar | Thu Sep 10 00:00:00 EDT 2015 - Fri Sep 11 00:00:00 EDT 2015 | Chicago, Illinois USA

Soldering 101

BEST Inc.

Career Center - Resumes: planes (6)

SMT Production Engineer

Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production

• Excellent Analytical, inter-personal and communication skills                 • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

Express Newsletter: planes (26)

Partner Websites: planes (50)

BGA Rework Machine - Model SV560 – Precision PCB Services, Inc.

| https://precision-pcb-services-inc.com/products/bga-rework-machine-model-sv560

.  The 3600 watt Rapid-IR underheater is a critical feature to rework large PCB's with many layers or heavy ground planes. Features: High Resolution 2 Mega Pixel HDMI Vision System Fits Boards up to 25" or upgradabe to 36" Places components from

Multi Job Optimiser - SMT Pick And Place Machine Manufacturer

EUROPLACER | https://www.europlacer.com/es/multi-job-optimiser/

Automática CircuitCam Express Multi Job Optimiser Multi Job Optimiser Nuestra opción de optimización (Multi job optimiser) de múltiples órdenes de trabajo crea planes de carga comunes para grupos de trabajos, minimiza los cambios del alimentador, reduce significativamente los tiempos de cambio de productos y mejora el rendimiento

EUROPLACER


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