Electronics Forum: planes (Page 1 of 41)

Barrel fill with Pb Free Wave Solder

Electronics Forum | Wed Dec 10 16:15:24 EST 2008 | terryl

on the front end in design, minimize the pth connections to ground planes. this takes alot of work by the pcb designer and the approval of the design engineer. connect maximum of 4 ground planes to pth, minimum 1 plane. use spoked connections. ev

QFN Side fillet

Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef

IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -

Thermals on BGA vias to power plane

Electronics Forum | Mon Mar 23 15:41:46 EST 1998 | Stuart Adams

Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.

Very fishy missing solder paste issue

Electronics Forum | Tue Jul 19 12:10:04 EDT 2005 | CLampron

Sr. tech, The mount tool test position is what I am refering to. The function of this is to determine the placement plane of the board. The mount plane will change if the board is thicker so thickness is relavent. regards Chris

SN100C wetting problems

Electronics Forum | Fri Jul 13 12:27:30 EDT 2007 | jseagle

As in more dwell? We see the same problem with through holes connected to power or ground planes. The solder reaches the plane and stops. We are having our boards re-designed to increase the thermal relief and expand the hole size. We are also tr

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Wed Oct 15 17:40:42 EDT 2008 | bandjwet

Dear SMTNetters: What are some favorite techniques for getting all of the solder from a plated throughhole on a heavy ground plane area? We are using a SAC 405 alloy. Regards BWET

PCB oxidation

Electronics Forum | Fri Jun 17 13:51:21 EDT 2011 | mosborne1

Your problem is at your board house with the finish. There is not enough tin deposited on the ground plane. Could be the current density too low on the ground plane. If electroless they just didn't process these correctly. What is the finish suppose

Designers Are Babies

Electronics Forum | Wed Dec 19 21:21:02 EST 2012 | davef

MosheSh: When it comes to ground planes, most designers are out over their skis. They don't understand what's going on or how it affects their design. So, they get massively conservative about the number of plane layers, whether they can be hatched o

Re: Thermals on BGA vias to power plane

Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon

Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab

RoHS Board Delamination

Electronics Forum | Tue Oct 31 09:43:06 EST 2006 | SWAG

Yes, this board is approx. 3" x 17" x .062"T with large areas of ground planes. However, the delam. does not seem to be confined to the plane. We also see it around component pads and fiducials. Generally speaking, it could be said that the first

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