Electronics Forum: planes (Page 16 of 40)

Re: Profiling on populated or unpopulated board?

Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon

Hi, Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? Joe What's the cost of not doing it. In the same breath, why not wait for a sc

Re: Punched vs, Routered PCB's

Electronics Forum | Sun Nov 22 06:58:36 EST 1998 | Kallol Chakraborty

3 lyr with gnd /pwr plane (most of the mixed has sheilding). I guess I am just repeating what Earl has said earlier. It would be nice to ask them for sub-ing it out for scoring as sometimes it is hard to route (SS or DS). I am pretty sure that

Minimizing Board Warpage During Reflow

Electronics Forum | Tue Jun 02 20:26:17 EDT 1998 | Anthony

Does anybody know if a contraption exists that will minimize a PCB's tendency to become slightly bent after reflow? We have a new product that we're planning to assemble in a couple of months. The board is 9.7" by 13.4" and it is imperitive that we

Wave Soldering Ceramic PCB's

Electronics Forum | Thu Aug 09 23:11:23 EDT 2001 | davef

Cheery disposition??? Would a few ;-) ;-) ;-) help? [Oh and look who is talking, the one planning the Mickie D gig after the traces on the this board start vaporizing with the fuseable link schtik.] Are you sure you're getting flux all the way up

Wave Soldering Thick PCB's

Electronics Forum | Mon Jan 21 09:27:02 EST 2002 | JohnW

Here's a question for you to mull over. I've got a PCB that is 4 millimeters thick, that's about 160thou of USA money if you like it that way. The question is IPC reg's for hole fill say it should be a min of 75% hole fill and 50% on ground planes. A


Electronics Forum | Fri Oct 11 03:17:52 EDT 2002 | Adam

Guys I was wondering if anybody has some useful advice with regards to achieving 100% solder penetration on one pin of a through hole device which I believe is attached to a ground plane. All other pins on the through hole device are fine, Just this

Soldering an 18 layer 2oz. copper board

Electronics Forum | Mon Oct 21 11:49:20 EDT 2002 | sueph

Mike, We are currently wave soldering several assemblies with with a lot of ground plane. The soldering handbook we have in house suggests a preheat temp for metal core multilayer boards of 230 to 270 degrees F' (110 to 130 C'). It was scary at fir


Electronics Forum | Thu Oct 31 16:13:46 EST 2002 | babe

If your processing with Nitrogen, tombstoning can be caused by your cooling rate. Go thru the solid/liquid phase of the solder slower..iN other words as you transition into or out of the liquidus pahse if 63/37 alloy 183C, ensure that your Delta are

BGA rework systems

Electronics Forum | Mon Nov 25 20:24:13 EST 2002 | bcceng

Maxtim, Again I have implemented BGA rework in four CM's and the machine that I have selected is the Conceptronics. In contract manufacturing you will have to be prepare to rework from the smallest to the largest boards with lots of ground planes. Co

Snapshot Process

Electronics Forum | Fri Jan 31 05:18:10 EST 2003 | reg

We have a customer who is going to be using the new Snapshot process. Has anyone used this process all ready. Who did you use to make the tooling etc. Was there any problems that arose during this process. The process involves screening balls into s

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