Electronics Forum: planes (Page 21 of 40)

Re: IR /Convection Preheats

Electronics Forum | Mon Jan 11 15:20:29 EST 1999 | Chrys

I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.

Re: Dummy Pads for Bridging Problems

Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory

On 11 May, 1998 Todd wrote: We are having continuous bridging problems with the trailing leads on a 26-pin D-sub through-hole connector. The pitch is 0.100". The connector is going through the wave at approximately a 20 Degree angle. Does

Wave Soldering Thick PCB's

Electronics Forum | Mon Jan 28 19:58:02 EST 2002 | davef

Thanks for cutting me some slack on that metric thang, pardner. ;-) ANALYSIS: What??? The 5DX is useful for something!!! Shut ma mouth!!! [Don't you say a thing. I think I know what you're thinking.] FOAM FLUXERS: Your correct, not having a fo

Acceptable level of defects for Wave Soldering

Electronics Forum | Wed Sep 15 23:15:55 EDT 2004 | pdeuel

Im with Pete, Zero defects. We have high defect rate for many reasons. No line tech, operators set up and run then when QA reports defects engneers are called. Not to make people mad but our process engneers are lacking practical experance to fix pro

Problem with solder joints in wave solder

Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval

Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu

Re: BGA Shorting problem

Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach

We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. Th

Post Script

Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike

We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter.

Re: clean glue stencil

Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F

Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h

Re: Wave Solder Dwell Time

Electronics Forum | Tue Nov 07 02:50:41 EST 2000 | CharTrain

A solder wetting balance will indicate a time of less than one second for wetting to occur to a solderable surface. The additional time is required to get the metalized surfaces up to soldering temperature. A single sided board has very little mass a

Re: Release difficult from thick stencil

Electronics Forum | Wed Nov 01 12:19:42 EST 2000 | Fraser

Steve, someone somewhere is feeding you a line!! if you increase the draft angle from to / \ on your laser cut stencil you increase the surface area of the side wall and hence increase the likelyhood of the paste sticking in the aperture. Whats m


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