Electronics Forum: planes (Page 36 of 40)

Via holes and Wave Solder

Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry

Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on


Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika

Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri


Electronics Forum | Fri Jan 12 09:04:18 EST 2007 | Cal

For insurance purposes we verification... Here is a snippet from Glenbrooks website. From http://www.glenbrooktech.com Design Safety Standards The design safety standards pertaining to Industrial X-ray Inspection Systems can be found in "Code of


Electronics Forum | Fri Apr 20 14:02:26 EDT 2007 | JJ

RA, First, define "medium scale budget". Aside from that, I have used many systems, listed in my order of preference: 1. SRT1100 - superior board support - very reliable 2. ERSA IR550A - unique flexability due to infrared heaters 3. Metcal APR5000 -

Seica Firefly - Issues?

Electronics Forum | Fri Mar 21 15:51:23 EDT 2008 | g2garyg2

Thought I would reply and try to assist. PROMATION, my company, also manufactures Diode Laser soldering systems but with this stated we also manufacturer iron tip systems, soft beam systems and hot air solutions. The reasons are simple. Diode Laser

What caused this reflow issue?

Electronics Forum | Mon Apr 14 13:24:32 EDT 2008 | mmjm_1099

We had an order using a 2up PCB (same manufacturer) with same components and same board layout without any problems. Perfect run. The next order ran on the same day with same paste using same parts, same layout, same profile, but different 2up PCB h

BGA Placement Process

Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala

Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u

Solder balls on pads - lead free

Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef

My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r

MPM Accuflex, Lost Vision

Electronics Forum | Thu Aug 13 19:54:01 EDT 2015 | aemery

The camera assembly is designated as X23; the stencil & board lighting as well as the camera video signal pass through the DB9 connector at the camera. There is a ribbon cable in the vision gantry tray that carries both to the box on the left side o


Electronics Forum | Tue Oct 10 07:30:19 EDT 2017 | spoiltforchoice

TBH I think perhaps the OP deserved it, there is perfectly good explanation of Reflow and Process Window Index on Wikipedia for starters and if you want more all sorts of FREE specialist papers on things like reflowing flex circuit, lead/lead free et

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