Electronics Forum | Tue Feb 14 09:30:42 EST 2006 | cyber_wolf
Pardon me for being so bold, but I still cannot understand to this day why solder paste thawing is an issue. I am not sure what types of paste you all are using but it has been my experience that the only thing you gain by refrigerating is 3 months
Electronics Forum | Fri Sep 22 13:21:26 EDT 2006 | cyber_wolf
Dax, Just an FYI....we have had AP25's for years. I have never had to calibrate them. Also, I am not a MPM service guy but I would have to say that if your standard deviation numbers are coming up less than .001" you are doing ok there. Sounds to m
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Tue Jul 03 01:54:42 EDT 2018 | rdhiman1
Reaching out to all conformal coating experts, please help! While setting up conformal coating using the automated atomized spray, we observing issues associated with conformal coating wetting on the following regions: 1) Component edges 2) Metalli
Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper
A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus
Electronics Forum | Wed Jul 05 20:54:17 EDT 2000 | Dave F
Hi Patrick: Mike is correct. Taking it a little differently ... The approach you take is dependent on: 1 Type of gold finish 2 Source of the staining. Since you�re talking gold fingers, this is probably hard gold. So, � * If it�s a water or an o
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez
hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr
