Electronics Forum: plate (Page 121 of 260)

PCB type for BGA

Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ

Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w

support pins for double sided boards

Electronics Forum | Wed Sep 20 15:56:44 EDT 2006 | Rapid

There is a quick change dedicated tooling solution. It involves a "h-tower" and a machined vacuum (or non-vacuum) plate. There are two 8mm threaded holes on the table that are there for support tooling interface. The tower or tooling bolts to thos

Phosphorus Crystal Formation

Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef

You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a

ENIG or flash?

Electronics Forum | Thu Nov 30 09:51:53 EST 2006 | Loco

Thanks for the replies, it is getting clearer now. We called a PCB supplier and acted if we didnt know what was what, he actually told us its all the same, chemical, flash, immersion, all the same... It is now getting clearer why we are sometimes ge

PCB finish for compression mount connectors (LGA's)

Electronics Forum | Tue Dec 19 21:23:39 EST 2006 | davef

We'd suggest using your connector supplier recommendations. Some use: * Pad Plating: 20-30 uin Au over 50 uin Ni (You might get away with less gold) * In-Pad Vias: less than half the diameter of the button (for contact-only configurations) * PCB/C

SMT machine shift to China

Electronics Forum | Thu Jan 18 08:34:40 EST 2007 | Rob

...and Boeing makes wings in China because they want to sell jets into the Chinese market. We make Airbus wings in the UK profiably & effeciently, so I'm sure uncle Sam can too. Minimum of 3000, a lot went via the States for tooling plate changes t

flux build up in oven flux filter unit clog

Electronics Forum | Tue Jan 23 23:28:54 EST 2007 | jovial_guy23

If you have flux deposits on the cooling plates, try out Zestron's VIGON RC101...It is an extremely good product especially for reflow ovens and wave solder systems. Check it out...Minimal maintenance water based chemistry with no flash point...Much

Nonwetting Components - why won't components wet to solder?

Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas

Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin

MPM SPM Supplies

Electronics Forum | Fri Feb 23 08:53:52 EST 2007 | russ

Ours does not have a vacuum option so that may be it, the machine came with an assortment of standoffs and support plates as well. it is not drilled out in a grid but does have the center tapped which I assume is for the vacuum tooling. Ours has a

Swatch Group Granted Lead Exemption?????

Electronics Forum | Wed Apr 18 15:14:16 EDT 2007 | flipit

Patrick, I knew Swatch applied for an exemption but was it granted? This is where I am confused. 1) Lead in finishes of components with pitch of 0.65 (650 microns) or less is exempt. Is this correct? Did this stem from Swatch? 2) This is for co


plate searches for Companies, Equipment, Machines, Suppliers & Information