Electronics Forum | Mon Aug 24 09:07:03 EDT 1998 | Earl Moon
| What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." I don't have to get that frustrated because I deal with those who do it right most of the time. You have to consider th
Electronics Forum | Tue Aug 25 06:59:04 EDT 1998 | Flyin' on my own
Thanks for the great info, man!! | | What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." | I don't have to get that frustrated because I deal with those who do it right m
Electronics Forum | Tue Aug 25 09:47:32 EDT 1998 | Earl Moon
| Thanks for the great info, man!! | | | | | What conditions make Earl Moon say "damn, why can't XXX get the HASL right? Just look at this crummy board. Get a RMA No. Stat." | | I don't have to get that frustrated because I deal with those who do
Electronics Forum | Thu Jul 02 15:23:15 EDT 1998 | Justin Medernach
| | I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built som
Electronics Forum | Mon May 18 11:50:23 EDT 1998 | Earl Moon
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
Electronics Forum | Fri Mar 14 11:04:54 EDT 2008 | herman
Samir, To correct some misconceptions on the answers to your question, and "what you know from experience": With both ENIG (Electroless Nickel/Immersion Gold-IAu) and IAg (immersion silver), soldering does not take place to the gold or the silver. Wh
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
