Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian
| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath
Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon
| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
Electronics Forum | Wed Aug 18 05:09:56 EDT 1999 | Brian
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt
| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
